The next generation of automotive systems are hungry for more. More advanced infotainment and ADAS1 systems. More storage for event data recording. Support for more 3D mapping.
In a move that makes ‘more’ a reality, KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.), the U.S.-based subsidiary of KIOXIA Corporation, today announced that it has begun sampling the industry’s first2 512 gigabyte (GB) Automotive Universal Flash Storage3 (UFS) JEDEC® Version 2.1 embedded memory solution. KIOXIA America’s Automotive UFS supports a wide temperature range (-40°C to +105°C), meets AEC-Q100 Grade24 requirements and offers the extended reliability required by various automotive applications. The 512GB device joins the company’s existing lineup of Automotive UFS, which includes capacities of 16GB, 32GB, 64GB, 128GB, and 256GB.
Innovations such as autonomous vehicles, more advanced infotainment systems, digital clusters, telematics, and ADAS provide not only an elevated driver experience but also a greater demand for storage within vehicles.
To meet this demand for large-capacity memory, KIOXIA’s new 512GB Automotive UFS memory was developed, which integrates the company’s BiCS FLASH™ 3D flash memory and a controller in a single package. 512GB Automotive UFS features several functions well-suited to the requirements of automotive applications including Refresh, Thermal Control and Extended Diagnosis. The Refresh function can be used to refresh data stored in UFS and helps extend the data’s lifespan. The Thermal Control function protects the device from overheating in the high-temperature circumstances that can occur in automotive applications. Lastly, the Extended Diagnosis function helps the host processor easily understand the device’s status.
“UFS is the best memory solution available that combines the high performance, power efficiency, and small package size that mobile devices and related applications demand,” noted Scott Beekman, director of managed flash memory products for KIOXIA America, Inc. “UFS performance will continue to advance, widening the already significant performance advantage it has over e-MMC5. The introduction of a 512GB UFS device for Automotive is yet another milestone for KIOXIA. We have led the way in UFS since 2013, when we were the first to sample the technology, and will continue to pave the road forward for the automotive applications of the future.”
 Advanced Driving Assistant System
 Source: KIOXIA Corporation, as of November 14, 2019.
 Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. JEDEC is a registered trademark of JEDEC Solid State Technology Association.
 Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).
 e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association.
Sample specifications may differ from mass production parts.
In every mention of a KIOXIA product: Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications. The definition of 1Gb = 2^30 bits = 1,073,741,824 bits. The definition of 1GB = 2^30 bytes = 1,073,741,824 bytes.
About KIOXIA America, Inc.
KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) is the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough BiCS FLASH™ 3D technology, KIOXIA continues to pioneer cutting-edge memory solutions and services that enrich people's lives and expand society's horizons. The company's innovative 3D flash memory technology, BiCS FLASH, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive, and data centers.
For more information, please visit www.KIOXIA.com.